Lee, C. S., Chun, M. S., Kim, M. H., Lee, J. M., Numerical Evaluation …
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작성자 최고관리자 댓글 0건 조회 188회 작성일 20-06-16 17:25| Date | 2020-06-16 |
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| Title | Lee, C. S., Chun, M. S., Kim, M. H., Lee, J. M., Numerical Evaluation for Debonding Failure Phenomenon of Adhesively Bonded Joints at Cryogenic Temperatures, Composites Science and Technology, 71(16), 1921-1929 |
본문
Title: Numerical Evaluation for Debonding Failure Phenomenon of Adhesively Bonded Joints at Cryogenic Temperatures
Journal: Composites Science and Technology
Author: Chi-Seung Lee, Min-Sung Chun, Myung-Hyun Kim, Jae-Myung Lee
Journal: Composites Science and Technology
Author: Chi-Seung Lee, Min-Sung Chun, Myung-Hyun Kim, Jae-Myung Lee
- 이전글Kim, M. H., Kil, Y. P., Lee, J. M., Chun, M. S., Suh, Y. S., Kim, W. S., Noh, B. J., Yoon, Cryogenic Fatigue Strength Assessment for MARK-III Insulation System of LNG Carriers, J. Of Offshore Mechanics And Arctic Engineering-Transactions Of The ASME,133 20.06.16
- 다음글Yoo, B. M. Lee, C. S., Chun, M. S., Kim, M. H., Lee, J. M., Computational Approach For Predicting The Crack Propagation Of Stainless Steel Plate Using Damage Mechanics, Computer Methods in Materials Science, 11(2), 303-308 20.06.16
