Lee, C. S., Yoo, B. M., Chun, M. S., Kim, M. H., Lee, J. M., Numerical…
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작성자 최고관리자 댓글 0건 조회 189회 작성일 20-07-06 14:57| Date | 2020-07-06 |
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| Title | Lee, C. S., Yoo, B. M., Chun, M. S., Kim, M. H., Lee, J. M., Numerical Evaluation for Delamination Failure of Multi-Laminated Bonding System under Cryogenic Temperature, 6th International Conference on Meshless and Other Novel Computational Methods |
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제목: Numerical Evaluation for Delamination Failure of Multi-Laminated Bonding System under Cryogenic Temperature
학회명: 6th International Conference on Meshless and Other Novel Computational Methods
학회명: 6th International Conference on Meshless and Other Novel Computational Methods
- 이전글Yoo, B. M., Lee, C. S., Chun, M. S., Kim, M. H., Lee, J. M., Computational Approach for Predicting the Crack Propagation of Stainless Streel Plate using Damage Mechanics, 6th International Conference on Meshless and Other Novel Computational Methods 20.07.06
- 다음글Park, W. S., Lee, C. S., Kim, M. H., Lee, J. M., Temperature and train Rate Dependent Characteristics of AISI 300 Series of Austenitic Stainless Steel, 29th International Conference on Ocean, Offshore and Arctic Engineering 20.07.06
